Evonik
Evonik
Evonik is to showcase its broad 3D printing material portfolio at the upcoming Formnext show in Frankfurt.
The company says its ‘ready-to-use’ high-performance materials and additives will help move 3D printing closer to bulk manufacturing.
Evonik’s play in the additive manufacturing is two decades old, developing its first synthetic powder for an additive process in 1996. In recent years, the company has accelerated its presence in the industry with a number of acquisitions, investments, product developments and partnerships.
Among those was the takeover of Structured Polymers and Evonik will introduce the first material product developed with the business’ patented technology. The material is a highly elastic and tough copolyester which can be developed in white or black and expands the company’s offering of flexible thermoplastics. Other materials to be showcased at Formnext will be Polyamide 613, which boasts a heat deflection temperature of around 195°C and low water absorption, and an implant-quality PEEK material developed for extrusion-based printing technologies.
“Our concept comprises efficient coordination of materials and equipment, developed in close consultation with our customers, Thomas Große-Puppendahl, Head of Evonik’s Additive Manufacturing Innovation Growth Field. “Our range of innovative high-performance materials will pave the way for industrial manufacturing of components with 3D printing.”
Evonik has also revealed a strategic research collaboration with Voxeljet to create polymer powder-based systems powdered by the binder jet process. This comes after the company began working with Cubicure to develop light-curing resin systems with its Hot Lithography technology.
“[Evonik’s] strategic focus is on developing and manufacturing ‘ready-to-use’ high-performance materials to meet the requirements of major technology lines,” Große-Puppendahl said. “Close cooperation with our customer and partners is a prerequisite for advancing innovations.”
Evonik will exhibit in Hall 12.1 Stand C71 at Formnext next month.
