Farsoon signs strategic partnership with Siemens
China-based additive manufacturing (AM) company Farsoon Technologies has announced it has signed a collaboration agreement with Siemens (Siemens China) to establish a framework for industrial AM solutions.
Announced yesterday at the 21st China International Industry Fair (CIIF) in Shanghai, the two are set to combine expertise and resources on the implementation of Siemens software and “digital twin” solutions with Farsoon’s open platform AM systems.
“We are very excited to start this collaboration with Siemens. Over the years, Farsoon have seen an increasing application of AM technology in the aerospace, industry manufacturing, medical, automotive and molds,” Dr. Xu Xiaoshu, Founder and CEO of Farsoon, explained. “With joint efforts with Siemens, we will be able to offer high-performance and streamlined workflow AM solutions for industrial customers in China and overseas.”
Siemens' digital twin products are virtual representation of a physical product or process and can be used throughout the product lifecycle, from concept to monitoring in the field, to simulate, predict, and optimise a product or process within a virtual environment. With this AM-focused partnership, the companies are said to be working together to “push the boundaries of additive manufacturing towards Industry 4.0.”
“Additive technology is driving the next revolution of industrial manufacturing, it changes our mindsets from products design, manufacturing process to business models,” Wang Haibin, Executive Vice President of Siemens Ltd., China and General Manager of Digital Industries Siemens Greater China added. “We are glad to collaborate with Farsoon to expand the industrial applications of the additive manufacturing.”
Earlier this year, Farsoon introduced its new high-speed sintering Flight Technology system which is said to deliver significant increases in AM speed and quality. The company has also struck a number of additional industry partnerships this year including materials collaborations with Airbus Beijing Engineering Centre, and another with Autodesk and Arkema.
